JPH081564Y2 - セラミック基板回路のリード線構造 - Google Patents

セラミック基板回路のリード線構造

Info

Publication number
JPH081564Y2
JPH081564Y2 JP1990011118U JP1111890U JPH081564Y2 JP H081564 Y2 JPH081564 Y2 JP H081564Y2 JP 1990011118 U JP1990011118 U JP 1990011118U JP 1111890 U JP1111890 U JP 1111890U JP H081564 Y2 JPH081564 Y2 JP H081564Y2
Authority
JP
Japan
Prior art keywords
lead wire
ceramic substrate
lead
mount
lead wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990011118U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03103560U (en]
Inventor
哲生 高橋
昭夫 佐々木
博 池田
隆夫 工藤
晃 小野寺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP1990011118U priority Critical patent/JPH081564Y2/ja
Publication of JPH03103560U publication Critical patent/JPH03103560U/ja
Application granted granted Critical
Publication of JPH081564Y2 publication Critical patent/JPH081564Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)
JP1990011118U 1990-02-07 1990-02-07 セラミック基板回路のリード線構造 Expired - Lifetime JPH081564Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990011118U JPH081564Y2 (ja) 1990-02-07 1990-02-07 セラミック基板回路のリード線構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990011118U JPH081564Y2 (ja) 1990-02-07 1990-02-07 セラミック基板回路のリード線構造

Publications (2)

Publication Number Publication Date
JPH03103560U JPH03103560U (en]) 1991-10-28
JPH081564Y2 true JPH081564Y2 (ja) 1996-01-17

Family

ID=31514655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990011118U Expired - Lifetime JPH081564Y2 (ja) 1990-02-07 1990-02-07 セラミック基板回路のリード線構造

Country Status (1)

Country Link
JP (1) JPH081564Y2 (en])

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6460909A (en) * 1987-09-01 1989-03-08 Murata Manufacturing Co Shielded conductor
JPH01130487A (ja) * 1987-11-16 1989-05-23 Mitsubishi Electric Corp リード挿入機
JPH01103277U (en]) * 1987-12-28 1989-07-12

Also Published As

Publication number Publication date
JPH03103560U (en]) 1991-10-28

Similar Documents

Publication Publication Date Title
US4775917A (en) Thermal compensated circuit board interconnect apparatus and method of forming the same
KR20160029117A (ko) 측면 엑세스 종결 패드를 갖는 인쇄 회로 기판
JPH081564Y2 (ja) セラミック基板回路のリード線構造
JPH06203894A (ja) 電気接続端子
JPH0648477A (ja) テーピング電子部品
JP2573623B2 (ja) 高周波機器の製造方法
JP2957230B2 (ja) 基板回路のリードピンの取付け方法
JPH0411984Y2 (en])
JP3703322B2 (ja) 電子部品
JPS62282456A (ja) ハイブリッドicの製造方法
JP2772937B2 (ja) チップ型電子部品の製造方法
JPH0227522Y2 (en])
JP3348596B2 (ja) 集積回路装置の製造方法
JPH066027A (ja) 回路モジュールの製造方法
JPS5844602Y2 (ja) プリント配線基板
JPS6228782Y2 (en])
JPS6311697Y2 (en])
JPH08204292A (ja) 電子部品の実装基板、実装治具及びその実装方法
JPH0818267A (ja) 電子回路モジュール
JPS6223478B2 (en])
JPH05343590A (ja) 半導体装置用リードフレーム
JP3563201B2 (ja) 電子部品
JPH0543512U (ja) 巻線部品の端末と電極の接続構造
JPS6021551A (ja) 半導体パッケ−ジのリ−ド付方法
CN109757093A (zh) 一种阵列式排列的电子元件及其表面贴装方法

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term